Author : Electrochemical Society. Meeting
Publisher : The Electrochemical Society
Page : 620 pages
File Size : 28,20 MB
Release : 2003
Category : Technology & Engineering
ISBN : 9781566773768
[PDF] Ulsi Process Integration Iii eBook
Ulsi Process Integration Iii Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Ulsi Process Integration Iii book. This book definitely worth reading, it is an incredibly well-written.
ULSI Process Integration
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 408 pages
File Size : 43,79 MB
Release : 1999
Category : Computers
ISBN : 9781566772419
ULSI Process Integration 7
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 429 pages
File Size : 28,71 MB
Release : 2011
Category :
ISBN : 1607682613
ULSI Process Integration 6
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 42,41 MB
Release : 2009-09
Category : Integrated circuits
ISBN : 1566777445
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
ULSI Process Integration 5
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 509 pages
File Size : 12,69 MB
Release : 2007
Category : Integrated circuits
ISBN : 1566775728
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
ULSI Process Integration II
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 16,34 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
ULSI Process Integration 9
Author : C. Claeys
Publisher : The Electrochemical Society
Page : 335 pages
File Size : 14,28 MB
Release : 2015
Category :
ISBN : 1607686759
Reduced Thermal Processing for ULSI
Author : Roland Levy
Publisher : Springer
Page : 466 pages
File Size : 18,32 MB
Release : 1989
Category : Computers
ISBN :
Very Good,No Highlights or Markup,all pages are intact.
Allgemeines Krankenhaus St. Georg in Hamburg 1823 - 1948
Author : Allgemeines Krankenhaus
Publisher :
Page : 87 pages
File Size : 41,3 MB
Release : 1948
Category :
ISBN :
ULSI Semiconductor Technology Atlas
Author : Chih-Hang Tung
Publisher : John Wiley & Sons
Page : 688 pages
File Size : 28,9 MB
Release : 2003-10-06
Category : Technology & Engineering
ISBN : 9780471457725
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs