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Author : Darrick M. Sellers
Publisher :
Page : pages
File Size : 36,91 MB
Release : 2003
Category :
ISBN :
Author : Ray T. Chen
Publisher : Morgan & Claypool Publishers
Page : 105 pages
File Size : 24,31 MB
Release : 2007
Category : Integrated circuits
ISBN : 1598290665
This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
Author : Xingyou Tian
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 28,31 MB
Release : 2023-12-11
Category : Technology & Engineering
ISBN : 3527352422
Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.
Author : Xiaobing Luo
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 47,89 MB
Release : 2024-08-12
Category : Technology & Engineering
ISBN : 1119179270
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author : Clemens J.M. Lasance
Publisher : Springer Science & Business Media
Page : 550 pages
File Size : 16,4 MB
Release : 2013-09-17
Category : Technology & Engineering
ISBN : 1461450918
Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.
Author : Fouad Sabry
Publisher : One Billion Knowledgeable
Page : 523 pages
File Size : 43,26 MB
Release : 2022-08-31
Category : Technology & Engineering
ISBN :
What Is Thermal Copper Pillar Bump The thermal copper pillar bump is a thermoelectric device that is made from thin-film thermoelectric material and is embedded in flip chip interconnects. It is used in the packaging of electronic and optoelectronic components, such as integrated circuits (chips), laser diodes, and semiconductor optical amplifiers. The thermal bump is also known as the thermal copper pillar bump (SOA). Thermal bumps, as opposed to traditional solder bumps, which provide an electrical path and a mechanical connection to the package, act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. Conventional solder bumps also provide a mechanical connection to the package. A thermal bump has a diameter of 238 micrometers and a height of 60 micrometers. How You Will Benefit (I) Insights, and validations about the following topics: Chapter 1: Thermal copper pillar bump Chapter 2: Solder Chapter 3: Printed circuit board Chapter 4: Ball grid array Chapter 5: Thermoelectric cooling Chapter 6: Flip chip Chapter 7: Thermoelectric materials Chapter 8: Desoldering Chapter 9: Thermal management (electronics) Chapter 10: Power electronic substrate Chapter 11: Flat no-leads package Chapter 12: Thermoelectric generator Chapter 13: Thermal management of high-power LEDs Chapter 14: Microvia Chapter 15: Thick-film technology Chapter 16: Soldering Chapter 17: Failure of electronic components Chapter 18: Glass frit bonding Chapter 19: Decapping Chapter 20: Thermal inductance Chapter 21: Glossary of microelectronics manufacturing terms (II) Answering the public top questions about thermal copper pillar bump. (III) Real world examples for the usage of thermal copper pillar bump in many fields. (IV) 17 appendices to explain, briefly, 266 emerging technologies in each industry to have 360-degree full understanding of thermal copper pillar bump' technologies. Who This Book Is For Professionals, undergraduate and graduate students, enthusiasts, hobbyists, and those who want to go beyond basic knowledge or information for any kind of thermal copper pillar bump.
Author :
Publisher :
Page : 212 pages
File Size : 37,65 MB
Release : 2001
Category : Integrated circuits
ISBN :
Author : Xiaobing Luo
Publisher : John Wiley & Sons
Page : 373 pages
File Size : 21,84 MB
Release : 2024-05-29
Category : Technology & Engineering
ISBN : 1119179297
A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Author :
Publisher :
Page : 782 pages
File Size : 31,95 MB
Release : 2004
Category : Trademarks
ISBN :
Author : Xingcun Colin Tong Ph.D
Publisher : Springer Science & Business Media
Page : 574 pages
File Size : 50,9 MB
Release : 2013-10-17
Category : Technology & Engineering
ISBN : 3319015508
This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.