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Author : John MACKEOWN
Publisher :
Page : pages
File Size : 22,80 MB
Release : 1948
Category :
ISBN :
Author : John McKeown
Publisher :
Page : 156 pages
File Size : 12,45 MB
Release : 1948
Category : Solder and soldering
ISBN :
Author : John McKeown
Publisher :
Page : 156 pages
File Size : 50,41 MB
Release : 1948
Category : Solder and soldering
ISBN :
Author : Howard H. Manko
Publisher : McGraw-Hill Professional Publishing
Page : 554 pages
File Size : 18,88 MB
Release : 2001
Category : Reference
ISBN :
Presenting 19 different methods for soldering and heating, this book discusses the strengths and weaknesses of each method. This work emphasizes techniques for soldering with miniaturized circuit boards.
Author : S. J. Nightingale
Publisher :
Page : 122 pages
File Size : 14,14 MB
Release : 1932
Category : Solder and soldering
ISBN :
Author : S. J. Nightingale
Publisher :
Page : 140 pages
File Size : 41,81 MB
Release : 1942
Category : Solder and soldering
ISBN :
Author : Giles Humpston
Publisher : ASM International
Page : 284 pages
File Size : 44,75 MB
Release : 2004
Category : Technology & Engineering
ISBN : 1615031707
Author : Arthur R. Maupin
Publisher :
Page : 32 pages
File Size : 10,72 MB
Release : 1940
Category : Joints (Engineering)
ISBN :
Author : John H. Lau
Publisher : Springer Science & Business Media
Page : 649 pages
File Size : 11,15 MB
Release : 2013-11-27
Category : Technology & Engineering
ISBN : 1461539102
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Author : S. J. Nightingale
Publisher :
Page : 126 pages
File Size : 20,96 MB
Release : 1929
Category : Solder and soldering
ISBN :