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Run-to-Run Control in Semiconductor Manufacturing

Author : James Moyne
Publisher : CRC Press
Page : 368 pages
File Size : 18,72 MB
Release : 2018-10-08
Category : Technology & Engineering
ISBN : 1420040669

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Run-to-run (R2R) control is cutting-edge technology that allows modification of a product recipe between machine "runs," thereby minimizing process drift, shift, and variability-and with them, costs. Its effectiveness has been demonstrated in a variety of processes, such as vapor phase epitaxy, lithography, and chemical mechanical planarization. The only barrier to the semiconductor industry's widespread adoption of this highly effective process control is a lack of understanding of the technology. Run to Run Control in Semiconductor Manufacturing overcomes that barrier by offering in-depth analyses of R2R control.

Control Performance Assessment of Run-to-run Control System Used in High-mix Semiconductor Manufacturing

Author : Xiaojing Jiang
Publisher :
Page : 250 pages
File Size : 13,92 MB
Release : 2012
Category :
ISBN :

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Control performance assessment (CPA) is an important tool to realize high performance control systems in manufacturing plants. CPA of both continuous and batch processes have attracted much attention from researchers, but only a few results about semiconductor processes have been proposed previously. This work provides methods for performance assessment and diagnosis of the run-to-run control system used in high-mix semiconductor manufacturing processes. First, the output error source of the processes with a run-to-run EWMA controller is analyzed and a CPA method (namely CPA I) is proposed based on closed-loop parameter estimation. In CPA I, ARMAX regression is directly applied to the process output error, and the performance index is defined based on the variance of the regression results. The influence of plant model mismatch in the process gain and disturbance model parameter to the control performance in the cases with or without set point change is studied. CPA I method is applied to diagnose the plant model mismatch in the case with set point change. Second, an advanced CPA method (namely CPA II) is developed to assess the control performance degradation in the case without set point change. An estimated disturbance is generated by a filter, and ARMAX regression method is applied to the estimated disturbance to assess the control performance. The influence of plant model mismatch, improper controller tuning, metrology delay, and high-mix process parameters is studied and the results showed that CPA II method can quickly identify, diagnose and correct the control performance degradation. The CPA II method is applied to industrial data from a high-mix photolithography process in Texas Instruments and the influence of metrology delay and plant model mismatch is discussed. A control performance optimization (CPO) method based on analysis of estimated disturbance is proposed, and optimal EWMA controller tuning factor is suggested. Finally, the CPA II method is applied to non-threaded run-to-run controller which is developed based on state estimation and Kalman filter. Overall process control performance and state estimation behavior are assessed. The influence of plant model mismatch and improper selection of different controller variables is studied.

Fundamentals of Semiconductor Manufacturing and Process Control

Author : Gary S. May
Publisher : John Wiley & Sons
Page : 428 pages
File Size : 27,1 MB
Release : 2006-05-26
Category : Technology & Engineering
ISBN : 0471790273

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A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.

Evaluation and Extension of Threaded Control for High-mix Semiconductor Manufacturing

Author : Ninad Narendra Patwardhan
Publisher :
Page : 108 pages
File Size : 40,79 MB
Release : 2010
Category :
ISBN :

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In the recent years threaded run-to-run (RtR) control algorithms have experienced drawbacks under certain circumstances, one such trait is when applied to high-mix of products such as in Application Specific Integrated Circuits (ASIC) foundries. The variations in the process are a function of the product being manufactured as well as the tool being used. The presence of semiconductor layers increases the number of times the lithography process must be repeated. Successive layers having different patterns must be exposed using different reticles/masks in order to maximize tool utilizations. The objectives of this research are to develop a set of methodologies for evaluation and extension of threaded control applied to overlay. This project defines methods to quantify the efficacy of threaded controls, finds the drawbacks of threaded control under production of high mix of semiconductors and suggests extensions and alternatives to improve threaded control. To evaluate the performance of threaded control, extensive simulations were performed in MATLAB. The effects of noise, disturbances, sampling and delays on the control and estimation performance of threaded controller were studied through these simulations. Based on the results obtained, several ideas to extend threaded control by reducing overall number of threads, by improving thread definitions and combination have been introduced. A unique idea of sampling the measurements dynamically based on the estimation accuracy is also presented. Future work includes implementing the extensions to threaded control suggested in this work in real production data and comparing the results without the use of those methods. Future work also includes building new alternatives to threaded control.

16th European Symposium on Computer Aided Process Engineering and 9th International Symposium on Process Systems Engineering

Author : Wolfgang Marquardt
Publisher : Elsevier
Page : 1127 pages
File Size : 34,14 MB
Release : 2006-08-02
Category : Science
ISBN : 0080525806

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This proceedings book contains the papers presented at the joint conference event of the 9th Symposium on Process Systems Engineering (PSE'2006) and the 16th European Symposium on Computer Aided Process Engineering (ESCAPE-16), held in Garmisch-Partenkirchen, Germany, from July 9 – July 13, 2006. The symposium follows the first joint event PSE’97 / ESCAPE-7 in Trondheim, Norway (1997). The last two venues of the ESCAPE symposia were Barcelona, Spain (2005) and Lisbon, Portugal (2004) and the most recent PSE symposia were held in Kunming, China (2003) and Keystone, Colorado, USA (2000). The purpose of both series is to bring together the international community of researchers engineers who are interested in computing-based methods in process engineering. The main objective of the symposium is to review and present the latest developments and current state in Process Systems Engineering and Computer Aided Process Engineering. The focus of PSE’2006 / ESCAPE-16 has been on Modelling and Numerical Methods, Product and Process Design, Operations and Control, Biological Systems, Infrastructure Systems, and Business decision support. * reviews and presents the latest developments and current state of Process Systems Engineering and Computer Aided Process Engineering * contains papers presented at a joint conference event * bringing together an international community of researchers and engineers interested in computing-based methods in Process Engineering