[PDF] Standard Test Method For Dielectric Breakdown Voltage And Dielectric Strength Of Solid Electrical Insulating Materials At Commercial Power Frequencies eBook

Author : Thomas Roy Crompton
Publisher : iSmithers Rapra Publishing
Page : 730 pages
File Size : 15,14 MB
Release : 2006
Category : Science
ISBN : 9781859574928

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The aim of this book is to familiarise the reader with all aspects of the techniques used in the examination of polymers, covering chemical, physiochemical and purely physical methods of examination. The types of techniques available to the polymer chemist and technician are described, and their capabilities, limitations and applications are discussed. The book is intended, for all staff who are concerned with instrumentation and methodology in the polymer laboratory including laboratory designers, engineers and chemists, and also those concerned with the implementation of analytical specifications and process control limits.

Author :
Publisher :
Page : 988 pages
File Size : 23,74 MB
Release : 2001
Category : Administrative law
ISBN :

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The Code of Federal Regulations is the codification of the general and permanent rules published in the Federal Register by the executive departments and agencies of the Federal Government.

Author : San Kyeong
Publisher : John Wiley & Sons
Page : 388 pages
File Size : 17,32 MB
Release : 2020-12-29
Category : Technology & Engineering
ISBN : 1119679761

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Discover the foundations and nuances of electrical connectors in this comprehensive and insightful resource Electrical Connectors: Design, Manufacture, Test, and Selection delivers a comprehensive discussion of electrical connectors, from the components and materials that comprise them to their classifications and underwater, power, and high-speed signal applications. Accomplished engineer and author Michael G. Pecht offers readers a thorough explanation of the key performance and reliability concerns and trade-offs involved in electrical connector selection. Readers, both at introductory and advanced levels, will discover the latest industry standards for performance, reliability, and safety assurance. The book discusses everything a student or practicing engineer might require to design, manufacture, or select a connector for any targeted application. The science of contact physics, contact finishes, housing materials, and the full connector assembly process are all discussed at length, as are test methods, performance, and guidelines for various applications. Electrical Connectors covers a wide variety of other relevant and current topics, like: A comprehensive description of all electrical connectors, including their materials, components, applications, and classifications A discussion of the design and manufacture of all parts of a connector Application-specific criteria for contact resistance, signal quality, and temperature rise An examination of key suppliers, materials used, and the different types of data provided A presentation of guidelines for end-users involved in connector selection and design Perfect for connector manufacturers who select, design, and assemble connectors for their products or the end users who concern themselves with operational reliability of the system in which they’re installed, Electrical Connectors also belongs on the bookshelves of students learning the basics of electrical contacts and those who seek a general reference with best-practice advice on how to choose and test connectors for targeted applications.

Author : Michael Pecht
Publisher : John Wiley & Sons
Page : 498 pages
File Size : 34,9 MB
Release : 1994-12-13
Category : Technology & Engineering
ISBN : 9780471594369

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All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.

Author : Roger Brown
Publisher : CRC Press
Page : 860 pages
File Size : 33,37 MB
Release : 1999-01-21
Category : Technology & Engineering
ISBN : 1482270021

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The Handbook of Polymer Testing: Physical Methods provides virtually currently used techniques for measuring and testing the physical properties of polymers. A concise but detailed technical guide to the physical testing methods of synthetic polymers in plastics, rubbers, cellular materials, textiles, coated fabrics, and composites, the book analys