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SiGe, Ge, and Related Compounds 4: Materials, Processing, and Devices

Author : D. Harame
Publisher : The Electrochemical Society
Page : 1066 pages
File Size : 44,33 MB
Release : 2010-10
Category : Science
ISBN : 1566778255

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Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds has become a key component in the arsenal in improving semiconductor performance. This symposium discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices

Author : David Harame
Publisher : The Electrochemical Society
Page : 1136 pages
File Size : 41,17 MB
Release : 2008
Category : Electronic apparatus and appliances
ISBN : 1566776562

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Advanced semiconductor technology is depending on innovation and less on "classical" scaling. SiGe, Ge, and Related Compounds have become a key component of the arsenal in improving semiconductor performance. This issue of ECS Transactions discusses the technology to form these materials, process them, FET devices incorporating them, Surfaces and Interfaces, Optoelectronic devices, and HBT devices.

SiGe and Ge

Author : David Louis Harame
Publisher : The Electrochemical Society
Page : 1280 pages
File Size : 21,13 MB
Release : 2006
Category : Electronic apparatus and appliances
ISBN : 1566775078

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The second International SiGe & Ge: Materials, Processing, and Devices Symposium was part of the 2006 ECS conference held in Cancun, Mexico from October 29-Nov 3, 2006. This meeting provided a forum for reviewing and discussing all materials and device related aspects of SiGe & Ge. The hardcover edition includes a bonus CD-ROM containing the PDF of the entire issue.

ULSI Process Integration 6

Author : C. Claeys
Publisher : The Electrochemical Society
Page : 547 pages
File Size : 14,10 MB
Release : 2009-09
Category : Integrated circuits
ISBN : 1566777445

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ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).