Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 496 pages
File Size : 13,36 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566772587
[PDF] Semiconductor Wafer Bonding Science Technology And Applications eBook
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Semiconductor Waffer Bonding Science Technology and Application
Author : International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Publisher :
Page : 485 pages
File Size : 42,34 MB
Release : 1993-12
Category : Technology & Engineering
ISBN : 9781566770682
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 498 pages
File Size : 24,76 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566772587
Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Author :
Publisher : The Electrochemical Society
Page : 476 pages
File Size : 24,22 MB
Release : 2005
Category : Microelectromechanical systems
ISBN : 9781566774604
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Author :
Publisher : The Electrochemical Society
Page : 588 pages
File Size : 34,99 MB
Release : 2008-10
Category : Microelectromechanical systems
ISBN : 1566776546
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Author : C. Colinge
Publisher : The Electrochemical Society
Page : 656 pages
File Size : 41,93 MB
Release : 2010-10
Category : Science
ISBN : 1566778239
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Semiconductor Wafer Bonding
Author : H. Baumgart
Publisher : The Electrochemical Society
Page : 310 pages
File Size : 32,48 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773607
Semiconductor Wafer Bonding 9: Science, Technology, and Applications
Author : Helmut Baumgart
Publisher : The Electrochemical Society
Page : 398 pages
File Size : 25,90 MB
Release : 2006
Category : Microelectromechanical systems
ISBN : 156677506X
This issue of ECS Transactions covers state-of-the-art R&D results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.
Proceedings of the ... International Symposium on Semiconductor Wafer Bonding
Author :
Publisher :
Page : 524 pages
File Size : 38,4 MB
Release : 1991
Category : Semiconductor wafers
ISBN :
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding
Author : U. Gösele
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 50,10 MB
Release : 1998
Category : Technology & Engineering
ISBN : 9781566771894