[PDF] Radecs eBook

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Publisher : Elsevier
Page : 967 pages
File Size : 42,44 MB
Release : 1999-02-11
Category : Technology & Engineering
ISBN : 0080534767

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Silicon technology today forms the basis of a world-wide, multi-billion dollar component industry. The reason for this expansion can be found not only in the physical properties of silicon but also in the unique properties of the silicon-silicon dioxide interface. However, silicon devices are still subject to undesired electrical phenomena called "instabilities". These are due mostly to the imperfect nature of the insulators used, to the not-so-perfect silicon-insulator interface and to the generation of defects and ionization phenomena caused by radiation. The problem of instabilities is addressed in this volume, the third of this book series. Vol.3 updates and supplements the material presented in the previous two volumes, and devotes five chapters to the problems of radiation-matter and radiation-device interactions. The volume will aid circuit manufacturers and circuit users alike to relate unstable electrical parameters and characteristics to the presence of physical defects and impurities or to the radiation environment which caused them.

Author : John D. Cressler
Publisher : CRC Press
Page : 1044 pages
File Size : 48,12 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1351832808

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Unfriendly to conventional electronic devices, circuits, and systems, extreme environments represent a serious challenge to designers and mission architects. The first truly comprehensive guide to this specialized field, Extreme Environment Electronics explains the essential aspects of designing and using devices, circuits, and electronic systems intended to operate in extreme environments, including across wide temperature ranges and in radiation-intense scenarios such as space. The Definitive Guide to Extreme Environment Electronics Featuring contributions by some of the world’s foremost experts in extreme environment electronics, the book provides in-depth information on a wide array of topics. It begins by describing the extreme conditions and then delves into a description of suitable semiconductor technologies and the modeling of devices within those technologies. It also discusses reliability issues and failure mechanisms that readers need to be aware of, as well as best practices for the design of these electronics. Continuing beyond just the "paper design" of building blocks, the book rounds out coverage of the design realization process with verification techniques and chapters on electronic packaging for extreme environments. The final set of chapters describes actual chip-level designs for applications in energy and space exploration. Requiring only a basic background in electronics, the book combines theoretical and practical aspects in each self-contained chapter. Appendices supply additional background material. With its broad coverage and depth, and the expertise of the contributing authors, this is an invaluable reference for engineers, scientists, and technical managers, as well as researchers and graduate students. A hands-on resource, it explores what is required to successfully operate electronics in the most demanding conditions.

Author : Steven H. Voldman
Publisher : John Wiley & Sons
Page : 472 pages
File Size : 10,1 MB
Release : 2008-04-15
Category : Technology & Engineering
ISBN : 9780470516164

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Interest in latchup is being renewed with the evolution of complimentary metal-oxide semiconductor (CMOS) technology, metal-oxide-semiconductor field-effect transistor (MOSFET) scaling, and high-level system-on-chip (SOC) integration. Clear methodologies that grant protection from latchup, with insight into the physics, technology and circuit issues involved, are in increasing demand. This book describes CMOS and BiCMOS semiconductor technology and their sensitivity to present day latchup phenomena, from basic over-voltage and over-current conditions, single event latchup (SEL) and cable discharge events (CDE), to latchup domino phenomena. It contains chapters focusing on bipolar physics, latchup theory, latchup and guard ring characterization structures, characterization testing, product level test systems, product level testing and experimental results. Discussions on state-of-the-art semiconductor processes, design layout, and circuit level and system level latchup solutions are also included, as well as: latchup semiconductor process solutions for both CMOS to BiCMOS, such as shallow trench, deep trench, retrograde wells, connecting implants, sub-collectors, heavily-doped buried layers, and buried grids – from single- to triple-well CMOS; practical latchup design methods, automated and bench-level latchup testing methods and techniques, latchup theory of logarithm resistance space, generalized alpha (a) space, beta (b) space, new latchup design methods– connecting the theoretical to the practical analysis, and; examples of latchup computer aided design (CAD) methodologies, from design rule checking (DRC) and logical-to-physical design, to new latchup CAD methodologies that address latchup for internal and external latchup on a local as well as global design level. Latchup acts as a companion text to the author’s series of books on ESD (electrostatic discharge) protection, serving as an invaluable reference for the professional semiconductor chip and system-level ESD engineer. Semiconductor device, process and circuit designers, and quality, reliability and failure analysis engineers will find it informative on the issues that confront modern CMOS technology. Practitioners in the automotive and aerospace industries will also find it useful. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, computer aided design and design integration.

Author : Paul Leroux
Publisher : MDPI
Page : 210 pages
File Size : 19,91 MB
Release : 2019-08-26
Category : Technology & Engineering
ISBN : 3039212796

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Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

Author : Martin Schulz
Publisher : Springer Nature
Page : 293 pages
File Size : 32,29 MB
Release : 2022-12-13
Category : Computers
ISBN : 3031218671

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This book constitutes the proceedings of the 35th International Conference on Architecture of Computing Systems, ARCS 2022, held virtually in July 2022. The 18 full papers in this volume were carefully reviewed and selected from 35 submissions. ARCS provides a platform covering newly emerging and cross-cutting topics, such as autonomous and ubiquitous systems, reconfigurable computing and acceleration, neural networks and artificial intelligence. The selected papers cover a variety of topics from the ARCS core domains, including energy efficiency, applied machine learning, hardware and software system security, reliable and fault-tolerant systems and organic computing.

Author : Ignacio R. Matias
Publisher : Springer
Page : 379 pages
File Size : 24,43 MB
Release : 2016-11-01
Category : Technology & Engineering
ISBN : 3319426257

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This book describes important recent developments in fiber optic sensor technology and examines established and emerging applications in a broad range of fields and markets, including power engineering, chemical engineering, bioengineering, biomedical engineering, and environmental monitoring. Particular attention is devoted to niche applications where fiber optic sensors are or soon will be able to compete with conventional approaches. Beyond novel methods for the sensing of traditional parameters such as strain, temperature, and pressure, a variety of new ideas and concepts are proposed and explored. The significance of the advent of extended infrared sensors is discussed, and individual chapters focus on sensing at THz frequencies and optical sensing based on photonic crystal structures. Another important topic is the resonances generated when using thin films in conjunction with optical fibers, and the enormous potential of sensors based on lossy mode resonances, surface plasmon resonances, and long-range surface exciton polaritons. Detailed attention is also paid to fiber Bragg grating sensors and multimode interference sensors. Each chapter is written by an acknowledged expert in the subject under discussion.