[PDF] Plasma Surface Interactions And Processing Of Materials eBook
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An understanding of the processes involved in the basic and applied physics and chemistry of the interaction of plasmas with materials is vital to the evolution of technologies such as those relevant to microelectronics, fusion and space. The subjects dealt with in the book include: the physics and chemistry of plasmas, plasma diagnostics, physical sputtering and chemical etching, plasma assisted deposition of thin films, ion and electron bombardment, and plasma processing of inorganic and polymeric materials. The book represents a concentration of a substantial amount of knowledge acquired in this area - knowledge which was hitherto widely scattered throughout the literature - and thus establishes a baseline reference work for both established and tyro research workers.
Plasma processing of materials is a critical technology to several of the largest manufacturing industries in the worldâ€"electronics, aerospace, automotive, steel, biomedical, and toxic waste management. This book describes the relationship between plasma processes and the many industrial applications, examines in detail plasma processing in the electronics industry, highlights the scientific foundation underlying this technology, and discusses education issues in this multidisciplinary field. The committee recommends a coordinated, focused, and well-funded research program in this area that involves the university, federal laboratory, and industrial sectors of the community. It also points out that because plasma processing is an integral part of the infrastructure of so many American industries, it is important for both the economy and the national security that America maintain a strong leadership role in this technology.
This book deals with the specific contact between the fourth state of matter, i.e. plasma, and the first state of matter, i.e. a solid wall, in controlled fusion experiments. A comprehensive analysis of the main processes of plasma-surface interaction is given together with an assessment of the most critical questions within the context of general criteria and operation limits. It also contains a survey on other important aspects in nuclear fusion.
This book is a primer on the interplay between plasma and materials in a fusion reactor, so-called plasma–materials interactions (PMIs), highlighting materials and their influence on plasma through PMI. It aims to demonstrate that a plasma-facing surface (PFS) responds actively to fusion plasma and that the clarifying nature of PFS is indispensable to understanding the influence of PFS on plasma. It describes the modern insight into PMI, namely, relevant feedback to plasma performance from plasma-facing material (PFM) on changes in a material surface by plasma power load by radiation and particles, contrary to a conventional view that unilateral influence from plasma on PFM is dominant in PMI. There are many books and reviews on PMI in the context of plasma physics, that is, how plasma or plasma confinement works in PMI. By contrast, this book features a materials aspect in PMI focusing on changes caused by heat and particle load from plasma: how PFMs are changed by plasma exposure and then, accordingly, how the changed PFM interacts with plasma.
NONTHERMAL PLASMAS FOR MATERIALS PROCESSING This unique book covers the physical and chemical aspects of plasma chemistry with polymers and gives new insights into the interaction of physics and chemistry of nonthermal plasmas and their applications in materials science for physicists and chemists. The properties and characteristics of plasmas, elementary (collision) processes in the gas phase, plasma surface interactions, gas discharge plasmas and technical plasma sources, atmospheric plasmas, plasma diagnostics, polymers and plasmas, plasma polymerization, post-plasma processes, plasma, and wet-chemical processing, plasma-induced generation of functional groups, and the chemical reactions on these groups along with a few exemplary applications are discussed in this comprehensive but condensed state-of-the-art book on plasma chemistry and its dependence on plasma physics. While plasma physics, plasma chemistry, and polymer science are often handled separately, the aim of the authors is to harmoniously join the physics and chemistry of low-pressure and atmospheric-pressure plasmas with polymer surface chemistry and polymerization and to compare such chemistry with classic chemistry. Readers will find in these chapters Interaction of plasma physics and chemistry in plasmas and at the surface of polymers; Explanation and interpretation of physical and chemical mechanisms on plasma polymerization and polymer surface modification; Introduction of modern techniques in plasma diagnostics, surface analysis of solids, and special behavior of polymers on exposure to plasmas; Discussion of the conflict of energy-rich plasma species with permanent energy supply and the much lower binding energies in polymers and alternatives to avoid random polymer decomposition Technical applications such as adhesion, cleaning, wettability, textile modification, coatings, films, etc. New perspectives are explained about how to use selective and mild processes to allow post-plasma chemistry on non-degraded polymer surfaces. Audience Physicists, polymer chemists, materials scientists, industrial engineers in biomedicine, coatings, printing, etc.
Plasma etching is finding new applications beyond the microelectronics industry. There are new challenges in the devising and controlling of plasma-surface interactions.
The current status of the science and technology related to coatings, thin films and surface modifications produced by directed energy techniques is assessed in Materials Surface Processing by Directed Energy Techniques. The subject matter is divided into 20 chapters - each presented at a tutorial level – rich with fundamental science and experimental results. New trends and new results are also evoked to give an overview of future developments and applications. Provides a broad overview on modern coating and thin film deposition techniques, and their applications Presents and discusses various problems of physics and chemistry involved in the production, characterization and applications of coatings and thin films Each chapter includes experimental results illustrating various models, mechanisms or theories
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.