[PDF] Physical Design For 3d Integrated Circuits eBook

Author : Aida Todri-Sanial
Publisher : CRC Press
Page : 397 pages
File Size : 44,16 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1498710379

GET BOOK

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Author : Sung Kyu Lim
Publisher : Springer Science & Business Media
Page : 573 pages
File Size : 37,88 MB
Release : 2012-11-27
Category : Technology & Engineering
ISBN : 1441995420

GET BOOK

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Author : Aida Todri-Sanial
Publisher : CRC Press
Page : 409 pages
File Size : 18,68 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1351830198

GET BOOK

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Author : Yuan Xie
Publisher : Springer Science & Business Media
Page : 292 pages
File Size : 17,12 MB
Release : 2009-12-02
Category : Technology & Engineering
ISBN : 144190784X

GET BOOK

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Author : Rohit Sharma
Publisher : CRC Press
Page : 302 pages
File Size : 13,86 MB
Release : 2018-09-03
Category : Technology & Engineering
ISBN : 1466589426

GET BOOK

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Author : Paul D. Franzon
Publisher : John Wiley & Sons
Page : 488 pages
File Size : 39,66 MB
Release : 2019-05-06
Category : Technology & Engineering
ISBN : 3527338551

GET BOOK

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Author : Chuan Seng Tan
Publisher : CRC Press
Page : 376 pages
File Size : 32,8 MB
Release : 2016-04-19
Category : Science
ISBN : 9814303828

GET BOOK

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Author : Solanki, Arun
Publisher : IGI Global
Page : 674 pages
File Size : 50,64 MB
Release : 2019-12-13
Category : Computers
ISBN : 1522596453

GET BOOK

As today’s world continues to advance, Artificial Intelligence (AI) is a field that has become a staple of technological development and led to the advancement of numerous professional industries. An application within AI that has gained attention is machine learning. Machine learning uses statistical techniques and algorithms to give computer systems the ability to understand and its popularity has circulated through many trades. Understanding this technology and its countless implementations is pivotal for scientists and researchers across the world. The Handbook of Research on Emerging Trends and Applications of Machine Learning provides a high-level understanding of various machine learning algorithms along with modern tools and techniques using Artificial Intelligence. In addition, this book explores the critical role that machine learning plays in a variety of professional fields including healthcare, business, and computer science. While highlighting topics including image processing, predictive analytics, and smart grid management, this book is ideally designed for developers, data scientists, business analysts, information architects, finance agents, healthcare professionals, researchers, retail traders, professors, and graduate students seeking current research on the benefits, implementations, and trends of machine learning.

Author : Hao Yu
Publisher : World Scientific
Page : 392 pages
File Size : 27,77 MB
Release : 2015-08-28
Category : Technology & Engineering
ISBN : 9814699039

GET BOOK

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.