Author :
Publisher : ASM International
Page : 487 pages
File Size : 39,5 MB
Release : 2010-01-01
Category : Technology & Engineering
ISBN : 1615037276
[PDF] Istfa 2010 eBook
Istfa 2010 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Istfa 2010 book. This book definitely worth reading, it is an incredibly well-written.
ISTFA 2009
Author :
Publisher : ASM International
Page : 371 pages
File Size : 47,75 MB
Release : 2009-01-01
Category : Technology & Engineering
ISBN : 1615030921
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
ISTFA 2011
Author :
Publisher : ASM International
Page : 479 pages
File Size : 44,86 MB
Release : 2011
Category : Technology & Engineering
ISBN : 1615038507
Istfa 2003
ASM International
Author : ASM International
Publisher : ASM International
Page : 534 pages
File Size : 27,44 MB
Release : 2003-01-01
Category : Technology & Engineering
ISBN : 1615030867
ISTFA 2012
ASM International
Author : ASM International
Publisher : ASM International
Page : 643 pages
File Size : 33,52 MB
Release : 2012
Category : Technology & Engineering
ISBN : 1615039953
ISTFA 2014
A. S. M. International
Author : A. S. M. International
Publisher : ASM International
Page : 561 pages
File Size : 41,45 MB
Release : 2014-11-01
Category : Technology & Engineering
ISBN : 1627080740
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2013
A. S. M. International
Author : A. S. M. International
Publisher : ASM International
Page : 634 pages
File Size : 28,6 MB
Release : 2013-01-01
Category : Technology & Engineering
ISBN : 1627080228
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
ISTFA 2010
Author :
Publisher :
Page : 464 pages
File Size : 28,6 MB
Release : 2010
Category : Electronic apparatus and appliances
ISBN : 9781680155105
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author :
Publisher : ASM International
Page : pages
File Size : 19,3 MB
Release : 2018-12-01
Category :
ISBN : 1627080996
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author :
Publisher : ASM International
Page : 540 pages
File Size : 31,98 MB
Release : 2019-12-01
Category : Technology & Engineering
ISBN : 1627082735
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.