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Microelectronic Systems

Author : Albert Heuberger
Publisher : Springer Science & Business Media
Page : 361 pages
File Size : 30,37 MB
Release : 2011-12-26
Category : Computers
ISBN : 3642230709

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This book is dedicated to Prof. Dr. Heinz Gerhäuser on the occasion of his retirement both from the position of Executive Director of the Fraunhofer Institute for Integrated Circuits IIS and from the Endowed Chair of Information Technologies with a Focus on Communication Electronics (LIKE) at the Friedrich-Alexander-Universität Erlangen-Nürnberg. Heinz Gerhäuser's vision and entrepreneurial spirit have made the Fraunhofer IIS one of the most successful and renowned German research institutions. He has been Director of the Fraunhofer IIS since 1993, and under his leadership it has grown to become the largest of Germany's 60 Fraunhofer Institutes, a position it retains to this day, currently employing over 730 staff. Likely his most important scientific as well as application-related contribution was his pivotal role in the development of the mp3 format, which would later become a worldwide success. The contributions to this Festschrift were written by both Fraunhofer IIS staff and external project team members in appreciation of Prof. Dr. Gerhäuser's lifetime academic achievements and his inspiring leadership at the Fraunhofer IIS. The papers reflect the broad spectrum of the institute's research activities and are grouped into sections on circuits, information systems, visual computing, and audio and multimedia. They provide academic and industrial researchers in fields like signal processing, sensor networks, microelectronics, and integrated circuits with an up-to-date overview of research results that have a huge potential for cutting-edge industrial applications.

IECON '84 Proceedings

Author : Institute of Electrical and Electronics Engineers
Publisher :
Page : 1240 pages
File Size : 15,90 MB
Release : 1984
Category : Industrial electronics
ISBN :

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3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer Nature
Page : 629 pages
File Size : 37,87 MB
Release : 2020-11-23
Category : Technology & Engineering
ISBN : 9811570906

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This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

Low Dielectric Constant Materials for IC Applications

Author : Paul S. Ho
Publisher : Springer Science & Business Media
Page : 323 pages
File Size : 28,21 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 3642559085

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Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for

3D Microelectronic Packaging

Author : Yan Li
Publisher : Springer
Page : 465 pages
File Size : 12,73 MB
Release : 2017-01-20
Category : Technology & Engineering
ISBN : 3319445863

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

Microelectronics and Change at Work

Author : J. R. Bessant
Publisher : International Labour Organisation
Page : 99 pages
File Size : 41,28 MB
Release : 1989
Category : Business & Economics
ISBN : 9789221065142

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