[PDF] High Performance Electrically Conductive Adhesives Ecas For Leadfree Interconnects eBook

Author : Yi Li
Publisher :
Page : pages
File Size : 42,99 MB
Release : 2007
Category : Adhesives Electric properties
ISBN :

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Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option.

Author : Yi (Grace) Li
Publisher : Springer Science & Business Media
Page : 445 pages
File Size : 27,6 MB
Release : 2009-10-08
Category : Technology & Engineering
ISBN : 0387887830

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“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Author :
Publisher : Emerald Group Publishing
Page : 72 pages
File Size : 36,61 MB
Release : 2006
Category : Electronic packaging
ISBN : 184663010X

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This issue of Soldering & Surface Mount Technology (SSMT) presents a number of papers from the 7th High Density Microsystems Design, Packaging and Failure Analysis (HDP'05) conference held in 2005 in the dynamic city of Shanghai, China. With over 100 high quality technical papers and presentation this annual conference brings together scholars and industrialists from Asia, Europe and the Americas to discuss the challenges and latest advances in high density packaging. This e-book contains six papers from the HDP conference, plus one additional contribution, which discuss the behaviour of key i.

Author : Rajesh Gomatam
Publisher : CRC Press
Page : 436 pages
File Size : 39,23 MB
Release : 2008-12-23
Category : Science
ISBN : 9004187820

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With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectroni

Author : Rongwei Zhang
Publisher :
Page : pages
File Size : 46,11 MB
Release : 2011
Category : Adhesives
ISBN :

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Isotropically conductive adhesives (ICAs) are promising as a lead-free interconnect material; However, ICAs have a higher resistivity compared to tin/lead solder. The higher resistivity of ICAs results from the large contact resistance between conductive fillers. Several novel approaches to engineer the interface between electrically conductive fillers were studied to develop highly conductive ICAs. Shown in this dissertation are three methodologies to reduce contact resistance: low temperature sintering, fast sintering and in-situ reduction. Furthermore, two approaches, surface modification and in-situ protection, were developed to prevent oxidation and corrosion of silver-coated copper flakes to produce low cost ICAs. The findings and insights in this dissertation significantly contribute to (1) understanding of filler-filler, filler-polymer and structure-property relationships of ICAs; (2) the structural design and formulation of high performance ICAs; and (3) the wider use of ICAs in emerging applications such as printed electronics and solar cells.

Author : John H. Lau
Publisher : McGraw Hill Professional
Page : 671 pages
File Size : 20,65 MB
Release : 2002-09-13
Category : Technology & Engineering
ISBN : 0071500871

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ELECTRONICS MANUFACTUIRNG WITH LEAD-FREE, HALOGEN-FREE, AND CONDUCTIVE-ADHESTIVE MATERIALS This comprehensive guide provides cutting edge information on lead-free, halogen-free, and conductive-adhesive technologies and their application to low-cost, high-density, reliable, and green products. Essential for electronics manufacturing and packaging professionals who wish to master lead-free, halogen-free, and conductive-adhesive problem solving methods, and those demanding cost-effective designs and high-yield environmental benign manufacturing processes, this valuable reference covers all aspects of this fast-growing field. Written for design, materials, process, equipment, manufacturing, reliability, component, packaging, and system engineers, and technical and marketing managers in electronics and photonics packaging and interconnection, this book teaches a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of lead-free, halogen-free, and conductive-adhesive technologies. Among the topics explored: * Chip (wafer) level interconnects with lead-free solder bumps * Lead-free solder wafer bumping with micro-ball mounting and paste printing methods * Lead-free solder joint reliability of WLCSPs on organic and ceramic substrates * Chip (wafer) level interconnects with solderless bumps such as Ni-Au, Au, and Cu, Cu wires, Au wires, Au studs, and Cu studs * Design, materials, process, and reliability of WLCSPs with solderless interconnects on PCB/substrate * Halogen-free molding compounds for PQFP, PBGA, and MAP-PBGA packages * Environmentally benign die-attach films for PQFP and PBGA packages and lead-free die-attach bonding techniques for IC packaging * Environmental issues for conventional PCBs and substrates * Some environmentally conscious flame-retardants for PCBs and organic substrates * Emerging technologies for fabricating environmental friendly PCBs such as design for environment, green PCB manufacturing, and environmental safety * Lead-free soldering activities such as legislation, consortia programs, and regional preferences on lead-free solder alternatives * Criteria, development approaches, and varieties of alloys and properties of lead-free solders * Physical, mechanical, chemical, electrical, and soldering properties of lead-free solders * Manufacturing process and performance of lead-free surface finishes for both PCB and component applications * Implementation and execution challenges of lead-free soldering, especially for the reflow and wave soldering process * Fundamental understanding of electrically conductive adhesive (ECA) technology * Effects of lubricant removal and cure shrinkage on ECAs * Mechanisms underlying the contact resistance shifts of ECAs * Effects of electrolytes and moisture absorption on contact resistance shifts of ECAs * Stabilization of contact resistance of ECAs using various additives

Author : Mikhail Baklanov
Publisher : John Wiley & Sons
Page : 508 pages
File Size : 36,83 MB
Release : 2007-04-04
Category : Technology & Engineering
ISBN : 0470065419

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The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Author : Vasudeva P. Atluri
Publisher :
Page : 226 pages
File Size : 21,57 MB
Release : 2007-04-09
Category : Technology & Engineering
ISBN :

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Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.

Author : M O Alam
Publisher : Elsevier
Page : 279 pages
File Size : 34,37 MB
Release : 2011-05-25
Category : Technology & Engineering
ISBN : 0857092898

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Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Author : Clinton Taubert
Publisher :
Page : 0 pages
File Size : 29,38 MB
Release : 2018
Category : Adhesives
ISBN :

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Electrically conductive adhesives (ECAs) have recently become a critical technological area in component development behind solar cell packaging for die attachment, solderless interconnects, and heat dissipation. The standard example of an ECA employs the use of conductive fillers within a polymeric matrix or host to render the final composite conductive. Electrical conductivity of an ECA is governed by percolation theory, wherein the necessary fillers that host electrons transfer, via physical connection or tunneling, must reach some critical volume fraction to accommodate probable conductive pathways that would be large enough to be considered isotropic [1,2]. Many fillers exist for use in this role, but commonly silver is chosen for its high electrical and thermal conductivities [3]. However, silver (especially micro- or nano-structured) remains an expensive commodity, and typical volume fraction loadings in ECA can approach >30%. This is necessary as the theoretical critical volume fraction required for monodisperse spheres in a randomly oriented isotropic system is ~16% [4]. Such excessive filler loading not only invalidates economic feasibility, but also deteriorates mechanical properties inherent for the host polymer. To mitigate the critical percolation threshold (pc) for volume fraction loading of a filler, combative methods are articulated herein. One approach is to use low-dimensional, high-aspect ratio fillers, such as graphene and carbon nanotubes (CNTs), which have been shown to lower pc [5,6]. Typically, such fillers are more expensive than silver; however, given the low-loading implied to achieve a percolated network, this approach could improve the economic feasibility as an added filler for reducing total filler loading required [7]. In this work, commercial CNTs are employed as a high-aspect ratio filler for the reduction of silver filler loading in an ECA system. Graphene nanoplatelets are also synthesized and used to demonstrate a route for creating tailored high-aspect ratio, low-dimensional fillers which are effective at generating a percolated network at relatively low loading. Utilizing a pre-percolated CNT system, a hybrid silver/CNT system was then generated to achieve enhanced conductivity at lower total loading over pure silver systems, which exhibited a conductivity of 54 S/cm at 12 vol.% loading with a CNT loading of only 8 wt.%. 1. Aharoni, S.M. Electrical Resistivity of a Composite of Conducting Particles in an Insulating Matrix J. Appl. Phys. 43, 2463-2465, (1972) 2 .McLachlan, D.S. et al. Electrical Resistivity of Composites. J. Am. Ceram. Soc. 73, 2187-2203 (1990) 3. Morris, J. E. Electrically Conductive Adhesives, A. Comprehensive Review. 37-77 (1999) 4. Bueche, F. Electrical resistivity of Conducting Particles in an Insulating Matrix. J. Appl. Phys. 43, 4837-8 (1972) 5. Lin, X.; Lin, F., Proceedings of High Density Microsystem Design an Packaging, Conference, Shanhai, China. 382-384 (2004) 6. Marcq, F. et al. Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives. Microelectron. Reliab. 51(7), 1230-1234 (2011) 7. Lyons, A. M. Electrically conductive adhesives, Effect of particle composition and size distribution. Polym. Eng. Sci. 31(6), 445-450, (1991)