[PDF] Design And Test Of Integrated Inductors For Rf Applications eBook
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Intended for engineers who are starting out in the design of integrated inductors, this book describes the whole design flow, basic selection of the geometry and optimisation of the quality by redesigning the geometry, measurement and de-embedding and characterisation.
With the ability to improve performance, reduce fabrication costs, and increase integration levels of both RX and TX sections of the RF/mm-wave front-end, passive inductive components have experienced extraordinary growth in ICs. Therefore, a fundamental understanding of monolithic inductors and transformers has become essential for all process eng
Varactors are passive semiconductor devices used in electronic circuits, as a voltage-controlled way of storing energy in order to boost the amount of electric charge produced. In the past, the use of low-cost fabrication processes such as complementary metal oxide semiconductor (CMOS) and silicon germanium (SiGe) were kept for integrated circuits working in frequency ranges below the GHz. Now, the increased working frequency of radio frequency integrated circuits (RF ICs) for communication devices, and the trend of system-on-chip technology, has pushed the requirements of varactors to the limit. As the frequency of RF applications continues to rise, it is essential that passive devices such as varactors are of optimum quality, making this a critical design issue. Initially describing the physical phenomena that occur in passive devices within standard IC fabrication processes, Design and Characterization of Integrated Varactors for RF Applications goes on to: present information on the design of wide band electrical varactor models (up to 5 GHz) which enable the accurate prediction of device performance; propose a specific methodology for the measurement of integrated varactors, covering on-wafer measurement structures, the calibration process, and detailed descriptions of the required equipment; explain de-embedding techniques and also analyse confidence level and uncertainty linked to the test set-up; examine the design of a voltage controlled oscillator (VCO) circuit as a practical example of the employment of methods discussed in the book. Providing the reader with the necessary technical knowledge for dealing with challenging VCO designs, this book is an essential guide for practising RF and microwave engineers working on the design of electronic devices for integrated circuits. It is also a useful reference for postgraduate students and researchers interested in electronic design for RF applications.
The modern wireless communication industry has put great demands on circuit designers for smaller, cheaper transceivers in the gigahertz frequency range. One tool which has assisted designers in satisfying these requirements is the use of on-chip inductiveelements (inductors and transformers) in silicon (Si) radio-frequency (RF) integrated circuits (ICs). These elements allow greatly improved levels of performance in Si monolithic low-noise amplifiers, power amplifiers, up-conversion and down-conversion mixers and local oscillators. Inductors can be used to improve the intermodulation distortion performance and noise figure of small-signal amplifiers and mixers. In addition, the gain of amplifier stages can be enhanced and the realization of low-cost on-chip local oscillators with good phase noise characteristics is made feasible. In order to reap these benefits, it is essential that the IC designer be able to predict and optimize the characteristics of on-chip inductiveelements. Accurate knowledge of inductance values, quality factor (Q) and the influence of ad- cent elements (on-chip proximity effects) and substrate losses is essential. In this book the analysis, modeling and application of on-chip inductive elements is considered. Using analyses based on Maxwells equations, an accurate and efficient technique is developed to model these elements over a wide frequency range. Energy loss to the conductive substrate is modeled through several mechanisms, including electrically induced displacement and conductive c- rents and by magnetically induced eddy currents. These techniques have been compiled in a user-friendly software tool ASITIC (Analysis and Simulation of Inductors and Transformers for Integrated Circuits).
After a review of PLL essentials, this uniquely comprehensive workbench guide takes you step-by-step through operation principles, design procedures, phase noise analysis, layout considerations, and CMOS realizations for each PLL building block. You get full details on LC tank oscillators including modeling and optimization techniques, followed by design options for CMOS frequency dividers covering flip-flop implementation, the divider by 2 component, and other key factors. The book includes design alternatives for phase detectors that feature methods to minimize jitter caused by the dead zone effect. You also find a sample design of a fully integrated PLL for WLAN applications that demonstrates every step and detail right down to the circuit schematics and layout diagrams. Supported by over 150 diagrams and photos, this one-stop toolkit helps you produce superior PLL designs faster, and deliver more effective solutions for low-cost integrated circuits in all RF applications.
The work establishes the design flow for the optimization of linear CMOS power amplifiers from the first steps of the design to the final IC implementation and tests. The authors also focuses on design guidelines of the inductor’s geometrical characteristics for power applications and covers their measurement and characterization. Additionally, a model is proposed which would facilitate designs in terms of transistor sizing, required inductor quality factors or minimum supply voltage. The model considers limitations that CMOS processes can impose on implementation. The book also provides different techniques and architectures that allow for optimization.
This second edition of the highly acclaimed RF Power Amplifiers has been thoroughly revised and expanded to reflect the latest challenges associated with power transmitters used in communications systems. With more rigorous treatment of many concepts, the new edition includes a unique combination of class-tested analysis and industry-proven design techniques. Radio frequency (RF) power amplifiers are the fundamental building blocks used in a vast variety of wireless communication circuits, radio and TV broadcasting transmitters, radars, wireless energy transfer, and industrial processes. Through a combination of theory and practice, RF Power Amplifiers, Second Edition provides a solid understanding of the key concepts, the principle of operation, synthesis, analysis, and design of RF power amplifiers. This extensive update boasts: up to date end of chapter summaries; review questions and problems; an expansion on key concepts; new examples related to real-world applications illustrating key concepts and brand new chapters covering ‘hot topics’ such as RF LC oscillators and dynamic power supplies. Carefully edited for superior readability, this work remains an essential reference for research & development staff and design engineers. Senior level undergraduate and graduate electrical engineering students will also find it an invaluable resource with its practical examples & summaries, review questions and end of chapter problems. Key features: • A fully revised solutions manual is now hosted on a companion website alongside new simulations. • Extended treatment of a broad range of topologies of RF power amplifiers. • In-depth treatment of state-of-the art of modern transmitters and a new chapter on oscillators. • Includes problem-solving methodology, step-by-step derivations and closed-form design equations with illustrations.
Identifying Emerging Trends in Technological Innovation Doctoral programs in science and engineering are important sources of innovative ideas and techniques that might lead to new products and technological innovation. Certainly most PhD students are not experienced researchers and are in the process of learning how to do research. Nevertheless, a number of empiric studies also show that a high number of technological innovation ideas are produced in the early careers of researchers. The combination of the eagerness to try new approaches and directions of young doctoral students with the experience and broad knowledge of their supervisors is likely to result in an important pool of innovation potential. The DoCEIS doctoral conference on Computing, Electrical and Industrial En- neering aims at creating a space for sharing and discussing ideas and results from doctoral research in these inter-related areas of engineering. Innovative ideas and hypotheses can be better enhanced when presented and discussed in an encouraging and open environment. DoCEIS aims to provide such an environment, releasing PhD students from the pressure of presenting their propositions in more formal contexts.
Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.
The book addresses the critical challenges faced by the ever-expanding wireless communication market and the increasing frequency of operation due to continuous innovation of high performance integrated passive devices. The challenges like low quality factor, design complexity, manufacturability, processing cost, etc., are studied with examples and specifics. Silicon on-chip inductor was first reported in 1990 by Nguyen and Meyer in a 0.8 μm silicon bipolar complementary metal oxide semiconductor technology (BiCMOS). Since then, there has been an enormous progress in the research on the performance trends, design and optimization, modeling, quality factor enhancement techniques, etc., of spiral inductors and significant results are reported in literature for various applications. This book introduces an efficient method of determining the optimized layout of on chip spiral inductor. The important fundamental tradeoffs of the design like quality factor and area, quality factor and inductance, quality factor and operating frequency, maximum quality factor and the peak frequency is also explored. The authors proposed an algorithm for accurate design and optimization of spiral inductors using a 3D electromagnetic simulator with minimum number of inductor structure simulations and thereby reducing its long computation time. A new multilayer pyramidal symmetric inductor structure is also proposed in this book. Being multilevel, the proposed inductor achieves high inductance to area ratio and hence occupies smaller silicon area.