[PDF] Application Of Chemical Mechanical Polishing To Planarization Of Surface Micromachined Devises eBook

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Page : 6 pages
File Size : 19,90 MB
Release : 1996
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Chemical-Mechanical Polishing (CMP) has emerged as an enabling technology for manufacturing multi-level metal interconnects used in high-density Integrated Circuits (IC). In this work we present extension of CMP from sub-micron IC manufacturing to fabrication of complex surface-micromachined Micro-ElectroMechanical Systems (MEMS). This planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. We discuss the CMP process and present examples of the use of CMP in fabricating MEMS devices such as microengines, pressures sensors, and proof masses for accelerometers along with its use for monolithically integrating MEMS devices with microelectronics.

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Page : 11 pages
File Size : 49,59 MB
Release : 1998
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Chemical-Mechanical-Polishing (CMP), first used as a planarization technology in the manufacture of multi-level metal interconnects for high-density Integrated Circuits (IC), is readily adapted as an enabling technology in MicroElectroMechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. The authors have demonstrated that CMP enhances the design and manufacturability of MEMS devices by eliminating several photolithographic definition and film etch issues generated by severe topography. In addition, CMP planarization readily allows multi-level polysilicon structures comprised of 4- or more levels of polysilicon, eliminates design compromise generated by non-planar topography, and provides an avenue for integrating different process technologies. A recent investigation has also shown that CMP is a valuable tool for assuring acceptable optical flatness of micro-optical components such as micromirrors. Examples of these enhancements include: an extension of polysilicon surface-micromachining fabrication to a 5-level technology, a method of monolithic integration of electronics and MEMS, and optically flat micromirrors.

Author : Yuzhuo Li
Publisher : John Wiley & Sons
Page : 760 pages
File Size : 40,3 MB
Release : 2007-12-04
Category : Technology & Engineering
ISBN : 9780470180891

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An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Author : S. V. Babu
Publisher :
Page : 304 pages
File Size : 21,71 MB
Release : 2000-02-10
Category : Technology & Engineering
ISBN :

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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Author :
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Page : 13 pages
File Size : 20,32 MB
Release : 1996
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The planarization technology of Chemical-Mechanical-Polishing (CMP), used for the manufacturing of multi-level metal interconnects for high-density Integrated Circuits (IC), is also readily adaptable as an enabling technology in Micro Electro Mechanical Systems (MEMS) fabrication, particularly polysilicon surface micromachining. CMP not only eases the design and manufacturability of MEMS devices by eliminating several photolithographic and film issues generated by severe topography, but also enables far greater flexibility with process complexity and associated designs. Thus, the CMP planarization technique alleviates processing problems associated with fabrication of multi-level polysilicon structures, eliminates design constraints linked with non-planar topography, and provides an avenue for integrating different process technologies. Examples of these enhancements include: an simpler extension of surface micromachining fabrication to multiple mechanical layers, a novel method of monolithic integration of electronics and MEMS, and a novel combination of bulk and surface micromachining.