[PDF] Advances In Electrometallurgy 3 2006 eBook

Author : V.F. Khorunov
Publisher : Elsevier Inc. Chapters
Page : 41 pages
File Size : 39,28 MB
Release : 2013-03-04
Category : Technology & Engineering
ISBN : 0128088753

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This chapter investigates the problem of brazing heat-resistant materials – high nickel-base and γ-TiAl-base intermetallic alloys. Diffusion brazing with filler metals of the Ni–Cr–B and Ni–Cr–B–Si systems is inefficient for nickel alloys, while composite filler metals based on these systems yield satisfactory results. When used as an alternative to boron- and silicon-containing filler metals, alloys of the Ni–Cr–Zr systems do not form hard and brittle phases at the interface in the joints. Filler metals based on the Ti–Zr system are best suited for joining γ-TiAl-base intermetallic alloys. Ti–Zr–Fe and Ti–Zr–Mn alloys, which show promise as brazing filler metals are selected, and structures and mechanical properties of the brazed joints are presented.

Author : Dušan P Sekulić
Publisher : Elsevier
Page : 625 pages
File Size : 45,26 MB
Release : 2013-03-04
Category : Technology & Engineering
ISBN : 0857096508

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Brazing processes offer enhanced control, adaptability and cost-efficiency in the joining of materials. Unsurprisingly, this has lead to great interest and investment in the area. Drawing on important research in the field, Advances in brazing provides a clear guide to the principles, materials, methods and key applications of brazing. Part one introduces the fundamentals of brazing, including molten metal wetting processes, strength and margins of safety of brazed joints, and modeling of associated physical phenomena. Part two goes on to consider specific materials, such as super alloys, filler metals for high temperature brazing, diamonds and cubic boron nitride, and varied ceramics and intermetallics. The brazing of carbon-carbon (C/C) composites to metals is also explored before applications of brazing and brazed materials are discussed in part three. Brazing of cutting materials, use of coating techniques, and metal-nonmetal brazing for electrical, packaging and structural applications are reviewed, along with fluxless brazing, the use of glasses and glass ceramics for high temperature applications and nickel-based filler metals for components in contact with drinking water. With its distinguished editor and international team of expert contributors, Advances in brazing is a technical guide for any professionals requiring an understanding of brazing processes, and offers a deeper understanding of the subject to researchers and engineers within the field of joining. Reviews the advances of brazing processes in joining materials Discusses the fundamentals of brazing and considers specific materials, including super alloys, filler metals, ceramics and intermetallics Brazing of cutting materials and structural applications are also discussed

Author : Govind S. Gupta
Publisher : Allied Publishers
Page : 524 pages
File Size : 47,94 MB
Release : 2009
Category : Iron
ISBN : 9788184245394

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Contributed articles presented in the International Conference on Advances in the Theory of Ironmaking and Steelmaking; organized by the Dept. of Material Engineering, IISc., Bangalore.

Author : Sudha Goel
Publisher : Springer
Page : 370 pages
File Size : 22,15 MB
Release : 2017-08-03
Category : Science
ISBN : 3319570765

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This book presents reviews, examples and case studies of innovative applications in solid and hazardous waste management. The economics of waste management have since become a significant research area in their own right, and two chapters address these issues. In addition, dedicated chapters cover specific categories of waste such as biomedical and institutional waste, plastics and e-waste. The book subsequently discusses newer analytical methods like SEM, EDX, XRD and optical microscopy, along with selected “older” methods for sampling and characterizing different types of waste. The various applications of mathematical tools like linear optimization, various software/models like WISCLeach, and DRASTIC, and tools like remote sensing and GIS are illustrated in many of the chapters. Lastly, since composting is one of the most popular treatment methods for managing the organic component of municipal solid waste, the book provides an overview of composting and the fundamentals of microbiology that are essential to understanding waste-related biological processes. The book was primarily written for students and practitioners in the field who are already familiar with the basics. All chapters were prepared by practicing experts and scholars in the field, and are intended to help readers better understand and apply these principles and practices in their own endeavours. Key topics covered in the book: • The circular economy and the economics of solid waste management • Various remote sensing and GIS applications for managing municipal solid waste, coal fires in mines, changes in land use and land cover in industrial areas, etc. • Treatment and management of different types of solid waste: institutional (including biomedical), residential, e-waste, plastic, and ash from thermal power plants • Sampling and characterization of municipal waste and compost • Fundamentals of microbiology • Overview of environmental regulations, especially those pertaining to solid and hazardous waste management

Author : Michael L. Free
Publisher : John Wiley & Sons
Page : 273 pages
File Size : 25,30 MB
Release : 2012-05-09
Category : Technology & Engineering
ISBN : 1118371380

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Proceedings of a symposium sponsored by The Metallurgy and Materials Society of CIM and the Hydrometallurgy and Electrometallurgy Committee of the Extraction and Processing Division of TMS (The Minerals, Metals & Materials Society) Held during the TMS 2012 Annual Meeting & Exhibition Orlando, Florida, USA, March 11-15, 2012

Author : Dongkai Shangguan
Publisher : CRC Press
Page : 463 pages
File Size : 33,11 MB
Release : 2024-06-28
Category : Technology & Engineering
ISBN : 1040028640

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In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Author : Cornelia Breitkopf
Publisher : Springer
Page : 1019 pages
File Size : 38,50 MB
Release : 2016-12-05
Category : Technology & Engineering
ISBN : 3662466570

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This comprehensive handbook covers all fundamentals of electrochemistry for contemporary applications. It provides a rich presentation of related topics of electrochemistry with a clear focus on energy technologies. It covers all aspects of electrochemistry starting with theoretical concepts and basic laws of thermodynamics, non-equilibrium thermodynamics and multiscale modeling. It further gathers the basic experimental methods such as potentiometry, reference electrodes, ion-sensitive electrodes, voltammetry and amperometry. The contents cover subjects related to mass transport, the electric double layer, ohmic losses and experimentation affecting electrochemical reactions. These aspects of electrochemistry are especially examined in view of specific energy technologies including batteries, polymer electrolyte and biological fuel cells, electrochemical capacitors, electrochemical hydrogen production and photoelectrochemistry. Organized in six parts, the overall complexity of electrochemistry is presented and makes this handbook an authoritative reference and definitive source for advanced students, professionals and scientists particularly interested in industrial and energy applications.

Author : Andrey G. Syrkov
Publisher : Trans Tech Publications Ltd
Page : 246 pages
File Size : 27,74 MB
Release : 2020-07-21
Category : Technology & Engineering
ISBN : 3035738025

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Selected, peer-reviewed papers from the Conference Nanophysics and Nanomaterials (NaN), on November 27-28, 2019, St. Petersburg, Russia.