[PDF] Advances In Chemical Mechanical Planarization Cmp eBook

Author : Babu Suryadevara
Publisher : Woodhead Publishing
Page : 650 pages
File Size : 43,84 MB
Release : 2021-09-10
Category : Technology & Engineering
ISBN : 0128218193

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Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Author : Babu Suryadevara
Publisher : Woodhead Publishing
Page : 538 pages
File Size : 44,29 MB
Release : 2016-01-09
Category : Technology & Engineering
ISBN : 0081002181

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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Author : Toshiro Doi
Publisher : William Andrew
Page : 330 pages
File Size : 30,29 MB
Release : 2011-12-06
Category : Science
ISBN : 1437778593

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CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Author : M.R. Oliver
Publisher : Springer Science & Business Media
Page : 444 pages
File Size : 25,90 MB
Release : 2004-01-26
Category : Technology & Engineering
ISBN : 9783540431817

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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Author : Gerfried Zwicker
Publisher : Cambridge University Press
Page : 0 pages
File Size : 48,93 MB
Release : 2007-11-13
Category : Technology & Engineering
ISBN : 9781558999510

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Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that occur when using CMP tools and pad/slurry consumables, as well as the surface mechanisms required for effective post-CMP cleaning. It also focuses on new successes and challenges in technologies such as electrochemical mechanical planarization (eCMP), three-dimensional integration and advanced CMP process modeling and control strategies.

Author : Hans Nørgaard Hansen
Publisher : MDPI
Page : 191 pages
File Size : 39,17 MB
Release : 2018-07-03
Category : Science
ISBN : 3038426040

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This book is a printed edition of the Special Issue "Micro/Nano Manufacturing" that was published in Micromachines

Author : Duane S. Boning
Publisher : Cambridge University Press
Page : 364 pages
File Size : 38,42 MB
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 9781107409415

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Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Author : S. Das
Publisher : Springer Nature
Page : 282 pages
File Size : 31,17 MB
Release : 2020-05-10
Category : Technology & Engineering
ISBN : 3030433129

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This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Author : Steven Liang
Publisher : Springer
Page : 241 pages
File Size : 15,12 MB
Release : 2015-12-29
Category : Technology & Engineering
ISBN : 1489976450

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This book provides readers with the fundamental, analytical, and quantitative knowledge of machining process planning and optimization based on advanced and practical understanding of machinery, mechanics, accuracy, dynamics, monitoring techniques, and control strategies that they need to understanding machining and machine tools. It is written for first-year graduate students in mechanical engineering, and is also appropriate for use as a reference book by practicing engineers. It covers topics such as single and multiple point cutting processes; grinding processes; machine tool components, accuracy, and metrology; shear stress in cutting, cutting temperature and thermal analysis, and machine tool chatter. The second section of the book is devoted to “Non-Traditional Machining,” where readers can find chapters on electrical discharge machining, electrochemical machining, laser and electron beam machining, and biomedical machining. Examples of realistic problems that engineers are likely to face in the field are included, along with solutions and explanations that foster a didactic learning experience.

Author : Cheol Seong Hwang
Publisher : Springer Science & Business Media
Page : 266 pages
File Size : 16,22 MB
Release : 2013-10-18
Category : Science
ISBN : 146148054X

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Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.