[PDF] A Model Of Troubleshooting In Electronics Assembly Manufacturing eBook

Author : Phil Zarrow
Publisher : Pragma Media
Page : 278 pages
File Size : 18,87 MB
Release : 2020-02-27
Category : Technology & Engineering
ISBN : 9781732283688

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BoardTalk had its humble beginnings as a SMT expert Q&A session with Phil Zarrow and Jim Hall at an SMTAI conference. Ten years and over 200 episodes later, the "Assembly Brothers - Pick and Place" have transcribed their informative discussions from CircuitInsight.com, where BoardTalk is streamed all over the world.

Author : Frank Riley
Publisher : Springer Science & Business Media
Page : 576 pages
File Size : 33,34 MB
Release : 2013-06-29
Category : Technology & Engineering
ISBN : 3662131617

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The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.

Author : Martin Helander
Publisher : CRC Press
Page : 424 pages
File Size : 34,98 MB
Release : 1992-06-18
Category : Technology & Engineering
ISBN : 9780748400096

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This work on a systems approach to ergonomic design-manufacturing includes information on ease of manual/automatic assembly, biomechanical, cognitive and perceptual workload, task allocation, job satisfaction, socio-technical systems design,

Author : Y.C. Lee
Publisher : Springer Science & Business Media
Page : 270 pages
File Size : 20,96 MB
Release : 2012-12-06
Category : Science
ISBN : 1461558034

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About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Author : Wade H. Shafer
Publisher : Springer Science & Business Media
Page : 350 pages
File Size : 10,18 MB
Release : 2012-12-06
Category : Science
ISBN : 1461528321

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Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1 957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thought that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 36 (thesis year 1991) a total of 11,024 thesis titles from 23 Canadian and 161 United States universities. We are sure that this broader base for these titles reported will greatly enhance the value of this important annual reference work. While Volume 36 reports theses submitted in 1991, on occasion, certain univer sities do report theses submitted in previous years but not reported at the time.

Author : William Ho
Publisher : Springer Science & Business Media
Page : 128 pages
File Size : 12,34 MB
Release : 2006-10-28
Category : Technology & Engineering
ISBN : 1846285003

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This advanced introduction to optimal production planning for PCB assembly details ways a reader can improve the efficiency of the assembly line in their company. It presents mathematical modeling techniques and heuristic solution approaches to optimize some critical PCB assembly problems arising in the industry.

Author : Shen Liu
Publisher : John Wiley & Sons
Page : 586 pages
File Size : 35,88 MB
Release : 2011-05-17
Category : Technology & Engineering
ISBN : 0470827807

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Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging