Author :
Publisher : The Electrochemical Society
Page : 404 pages
File Size : 13,67 MB
Release : 2003
Category : Technology & Engineering
ISBN : 9781566774024
[PDF] Semiconductor Wafer Bonding Vii Science Technology And Applications eBook
Semiconductor Wafer Bonding Vii Science Technology And Applications Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Semiconductor Wafer Bonding Vii Science Technology And Applications book. This book definitely worth reading, it is an incredibly well-written.
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Charles E. Hunt
Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 496 pages
File Size : 35,8 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566772587
Semiconductor Wafer Bonding VII : Science, Technology, and Applications
Author :
Publisher :
Page : 645 pages
File Size : 41,43 MB
Release : 2003
Category : Electronic apparatus and appliances
ISBN : 9780780376496
Semiconductor Wafer Bonding 10: Science, Technology, and Applications
Author :
Publisher : The Electrochemical Society
Page : 588 pages
File Size : 25,49 MB
Release : 2008-10
Category : Microelectromechanical systems
ISBN : 1566776546
This issue of ECS Transactions on Semiconductor Wafer Bonding will cover the state-of-the-art R&D results of the last 2 years in the field of semiconductor wafer bonding technology. Wafer Bonding is an Enabling Technology that can be used to create novel composite materials systems and devices that would otherwise be unattainable. Wafer Bonding today is rapidly expanding into new applications in such diverse fields as photonics, sensors, MEMS. X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI) and Nanotechnologies.
Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
C. Colinge
Author : C. Colinge
Publisher : The Electrochemical Society
Page : 656 pages
File Size : 33,72 MB
Release : 2010-10
Category : Science
ISBN : 1566778239
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
Semiconductor Wafer Bonding VIII : Science, Technology, and Applications
Author :
Publisher : The Electrochemical Society
Page : 476 pages
File Size : 18,27 MB
Release : 2005
Category : Microelectromechanical systems
ISBN : 9781566774604
Semiconductor Waffer Bonding Science Technology and Application
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Author : International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications. 2, 1993, Honolulu, Hawaii
Publisher :
Page : 485 pages
File Size : 28,93 MB
Release : 1993-12
Category : Technology & Engineering
ISBN : 9781566770682
Semiconductor Wafer Bonding : Science, Technology, and Applications V
Charles E. Hunt
Author : Charles E. Hunt
Publisher : The Electrochemical Society
Page : 498 pages
File Size : 32,35 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566772587
Semiconductor Wafer Bonding
H. Baumgart
Author : H. Baumgart
Publisher : The Electrochemical Society
Page : 310 pages
File Size : 37,78 MB
Release : 2002
Category : Technology & Engineering
ISBN : 9781566773607
Wafer Bonding
Marin Alexe
Author : Marin Alexe
Publisher : Springer Science & Business Media
Page : 510 pages
File Size : 24,85 MB
Release : 2013-03-09
Category : Science
ISBN : 3662108275
The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.