Full Read and Download Reference eBook
Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671 Book in PDF, ePub and Kindle version is available to download in english. Read online anytime anywhere directly from your device. Click on the download button below to get a free pdf file of Chemical Mechanical Polishing 2001 Advances And Future Challenges Volume 671 book. This book definitely worth reading, it is an incredibly well-written.
Author : Materials Research Society. Meeting
Publisher :
Page : 312 pages
File Size : 21,62 MB
Release : 2001-12-14
Category : Science
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.
Author : Suryadevara V. Babu
Publisher : Cambridge University Press
Page : 306 pages
File Size : 37,70 MB
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 9781107412187
With copper and barrier-layer integration firmly in place, several other exciting developments are occurring in the practice of chemical-mechanical polishing (CMP), and many advances are described in this book, first published in 2001. Discussions on CMP for shallow-trench isolation, abrasive-free slurries, improvements in pad and tool configurations including fixed abrasive pads, 'engineered' particles, effects of nanotopography, end-point studies, defect characterization and novel post-CMP cleaning methods are highlighted. Considerable progress has also been reported in modeling the complicated interactions that occur between the wafer surface and the pad and the slurry, whether containing abrasives or abrasive-free, and their influence on dishing and erosion and nonuniformity. These studies offer valuable insights for process improvements and yet many challenges remain and will provide a high level of interest for future books. Topics include: recent developments - pads and related issues; CMP abrasives; copper CMP/STI and planarization; STI and planarization - wear-rate models; low-k and integration issues - particle and process effects in CMP and issues in CMP cleaning.
Author :
Publisher :
Page : 312 pages
File Size : 41,30 MB
Release : 2001
Category : Electrolytic polishing
ISBN :
Author : Materials Research Society. Meeting
Publisher :
Page : 318 pages
File Size : 40,38 MB
Release : 2004-09
Category : Science
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).
Author : S. V. Babu
Publisher :
Page : 304 pages
File Size : 31,84 MB
Release : 2000-02-10
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Erin C. Jones
Publisher :
Page : 362 pages
File Size : 16,59 MB
Release : 2001-12-14
Category : Science
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Wen Jin Meng
Publisher :
Page : 480 pages
File Size : 28,14 MB
Release : 2002-08-27
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : A. Kumar
Publisher :
Page : 330 pages
File Size : 44,48 MB
Release : 2005-07-19
Category : Technology & Engineering
ISBN :
Technology requirements associated with the progressive scaling of devices for future technology nodes, coupled with the aggressive introduction of new materials, places tremendous demands on chemical-mechanical polishing. The goal of this 2005 book, which is part of a popular series from MRS, is to bring together experts from a broad spectrum of research and technology groups currently working on CMP, to review advances made, and to offer a comprehensive discussion of future challenges that must be overcome. The book shows trends in the development of consumables, process modules, tool designs, process integration, modeling, defect characterization, and metrology. Topics include: planarization processes and applications; consumables -CMP pads and slurries; CMP equipment and metrology; and CMP modeling and simulation.
Author : Materials Research Society. Meeting
Publisher :
Page : 456 pages
File Size : 11,22 MB
Release : 2002-05
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Duane S. Boning
Publisher :
Page : 376 pages
File Size : 25,74 MB
Release : 2003-08-27
Category : Technology & Engineering
ISBN :
Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.